Wang, Jung-Chang: search on Z-Library

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1

Analysis of thermal damage to laser irradiated tissue based on the dual-phase-lag model

Liu, Kuo-Chi, Wang, Jung-Chang

Journal:

International Journal of Heat and Mass Transfer

Year:

2014

Language:

english

File:

PDF, 530 KB

english, 2014

2

Air cooling for a large-scale motor

Chih-Chung Chang, Yu-Fu Kuo, Jung-Chang Wang, Sih-Li Chen

Journal:

Applied Thermal Engineering

Year:

2010

Language:

english

File:

PDF, 3.08 MB

english, 2010

3

Antibacterial activity of silver nanoparticle (AgNP) confined mesoporous structured bioactive powder against Enterococcus faecalis infecting root canal systems

Kung, Jung-Chang, Chen, Yi-Jhen, Chiang, Yu-Ching, Lee, Chung-Lin, Yang-Wang, Yuan-Ting, Hung, Chun-Cheng, Shih, Chi-Jen

Journal:

Journal of Non-Crystalline Solids

Year:

2018

Language:

english

File:

PDF, 2.20 MB

english, 2018

4

U- and L-shaped heat pipes heat sinks for cooling electronic components employed a least square smoothing method

Wang, Jung-Chang

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.71 MB

english, 2014

5

Development of 30 Watt high-power LEDs vapor chamber-based plate

Jung-Chang Wang, Rong-Tsu Wang, Tien-Li Chang, Daw-Shang Hwang

Journal:

International Journal of Heat and Mass Transfer

Year:

2010

Language:

english

File:

PDF, 3.07 MB

english, 2010

6

Antibacterial Activity of Silver Nanoparticles (AgNP) Confined to Mesostructured, Silica-Based Calcium Phosphate against Methicillin-Resistant Staphylococcus aureus (MRSA)

Kung, Jung-Chang, Wang, Wei-Hsun, Lee, Chung-Lin, Hsieh, Hao-Che, Shih, Chi-Jen

Journal:

Year:

2020

File:

PDF, 4.71 MB

2020

7

L-type heat pipes application in electronic cooling system

Jung-Chang Wang

Journal:

International Journal of Thermal Sciences

Year:

2011

Language:

english

File:

PDF, 1.24 MB

english, 2011

8

Experimental investigations of thermal resistance of a heat sink with horizontal embedded heat pipes

Jung-Chang Wang, Hsiang-Sheng Huang, Sih-Li Chen

Journal:

International Communications in Heat and Mass Transfer

Year:

2007

Language:

english

File:

PDF, 824 KB

english, 2007

9

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - HSHPTM program application in optimum of heat pipes thermal module

Wang, Jung-Chang, Chen, Wei-Jui, Fu-Hsiung Yu,

Year:

2012

Language:

english

File:

PDF, 854 KB

english, 2012

10

[IEEE 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2009.10.21-2009.10.23)] 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference - Vapor chamber in high performance server

Jung-Chang Wang,, Teng-Chieh Chen,

Year:

2009

Language:

english

File:

PDF, 1.65 MB

english, 2009

11

Optimization of heat flow analysis for exceeding hundred watts in HI-LEDs projectors

Wang, Rong-Tsu, Wang, Jung-Chang

Journal:

International Communications in Heat and Mass Transfer

Year:

2015

Language:

english

File:

PDF, 1.72 MB

english, 2015

12

Analyzing the structural designs and thermal performance of nonmetal lighting devices of LED bulbs

Wang, Rong-Tsu, Wang, Jung-Chang

Journal:

International Journal of Heat and Mass Transfer

Year:

2016

Language:

english

File:

PDF, 4.92 MB

english, 2016

13

Performance effects of heat transfer and geometry on heat pipe thermal modules under forced convection

Wang, Rong-Tsu, Lee, Ya-Wei, Chen, Sih-Li, Wang, Jung-Chang

Journal:

International Communications in Heat and Mass Transfer

Year:

2014

Language:

english

File:

PDF, 1.81 MB

english, 2014

14

Intelligent dimensional and thermal performance analysis of Al 2 O 3 nanofluid

Wang, Rong-Tsu, Wang, Jung-Chang

Journal:

Energy Conversion and Management

Year:

2017

Language:

english

File:

PDF, 1.71 MB

english, 2017

15

L- and U-shaped heat pipes thermal modules with twin fans for cooling of electronic system under variable heat source areas

Wang, Jung-Chang

Journal:

Heat and Mass Transfer

Year:

2014

Language:

english

File:

PDF, 2.71 MB

english, 2014

16

Superposition method to investigate the thermal performance of heat sink with embedded heat pipes

Jung-Chang Wang

Journal:

International Communications in Heat and Mass Transfer

Year:

2009

Language:

english

File:

PDF, 957 KB

english, 2009

17

Analyzing Thermal Module Developments and Trends in High-Power LED

Wang, Jung-Chang

Journal:

International Journal of Photoenergy

Year:

2014

Language:

english

File:

PDF, 2.27 MB

english, 2014

18

Thermal module design and analysis of a 230W LED illumination lamp under three incline angles

Wang, Jung-Chang

Journal:

Microelectronics Journal

Year:

2014

Language:

english

File:

PDF, 5.19 MB

english, 2014

19

Thermal Performance of a Vapor Chamber-Based Plate of High-Power Light-Emitting Diodes Filled with Al2O3 Nanofluid

Wang, Jung-Chang, Lin, Cherng-Yuan, Chen, Teng-Chieh

Journal:

Journal of Nanoscience and Nanotechnology

Year:

2013

Language:

english

File:

PDF, 1.47 MB

english, 2013

20

Application of self-heating graphene reinforced polyvinyl alcohol nanowires to high-sensitivity humidity detection

Chen, Zhao-Chi, Chang, Tien-Li, Su, Kai-Wen, Lee, Hsin-Sheng, Wang, Jung-Chang

Journal:

Sensors and Actuators B: Chemical

Year:

2021

File:

PDF, 8.47 MB

2021

21

Thermal investigations on LED vapor chamber-based plates

Jung-Chang Wang

Journal:

International Communications in Heat and Mass Transfer

Year:

2011

Language:

english

File:

PDF, 1.30 MB

english, 2011

22

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Hyper-generation LEDs VCPCB

Wang, Jung-Chang, Sung, Tian-Shiang, Chen, Wan-Ping

Year:

2011

Language:

english

File:

PDF, 801 KB

english, 2011

23

Microwave assisted synthesis of negative-charge carbon dots with potential antibacterial activity against multi-drug resistant bacteria

Kung, Jung-Chang, Tseng, I-Ting, Chien, Chi-Sheng, Lin, Sheng-Hui, Wang, Chun-Chi, Shih, Chi-Jen

Journal:

Year:

2020

File:

PDF, 700 KB

2020

24

A non-fluorine mold release agent for Ni stamp in nanoimprint process

Tien-Li Chang, Jung-Chang Wang, Chun-Chi Chen, Ya-Wei Lee, Ta-Hsin Chou

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 1.04 MB

english, 2008

25

[ASME ASME 2010 29th International Conference on Ocean, Offshore and Arctic Engineering - Shanghai, China (June 6–11, 2010)] 29th International Conference on Ocean, Offshore and Arctic Engineering: Volume 2 - Investigations on Scuba Diving Regulators

Wang, Jung-Chang, Tsai, Yu-Pin

Year:

2010

Language:

english

File:

PDF, 556 KB

english, 2010

26

Analysis for diving regulator applying local heating mechanism of vapor chamber in insert molding process

Jung-Chang Wang, Ai-Tsung Li, Yu-Pin Tsai, Ray-Quen Hsu

Journal:

International Communications in Heat and Mass Transfer

Year:

2011

Language:

english

File:

PDF, 998 KB

english, 2011

27

Analyzing the pressure-difference phenomenon between the condensing and boiling sections in a heat pipe cooling system

Rong-Tsu Wang, Jung-Chang Wang

Journal:

International Communications in Heat and Mass Transfer

Year:

2012

Language:

english

File:

PDF, 1.09 MB

english, 2012

28

Heat pipe for cooling of electronic equipment

Yu-Wei Chang, Chiao-Hung Cheng, Jung-Chang Wang, Sih-Li Chen

Journal:

Energy Conversion and Management

Year:

2008

Language:

english

File:

PDF, 423 KB

english, 2008

29

Analysis of suspension and heat transfer characteristics of Al2O3 nanofluids prepared through ultrasonic vibration

Cherng-Yuan Lin, Jung-Chang Wang, Teng-Chieh Chen

Journal:

Year:

2011

Language:

english

File:

PDF, 661 KB

english, 2011

30

[IEEE 2007 7th IEEE Conference on Nanotechnology (IEEE-NANO) - Hong Kong, China (2007.08.2-2007.08.5)] 2007 7th IEEE Conference on Nanotechnology (IEEE NANO) - Study of nanopattern forming with chemical coatings for silicon-based stamp in nanoimprint process

Tien-Li Chang,, Jung-Chang Wang,

Year:

2007

Language:

english

File:

PDF, 615 KB

english, 2007

31

[ACM Press the 46th Annual Design Automation Conference - San Francisco, California (2009.07.26-2009.07.31)] Proceedings of the 46th Annual Design Automation Conference on ZZZ - DAC '09 - Simulation and SAT-based Boolean matching for large Boolean networks

Wang, Kuo-Hua, Chan, Chung-Ming, Liu, Jung-Chang

Year:

2009

Language:

english

File:

PDF, 239 KB

english, 2009

32

[IEEE 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2012.10.24-2012.10.26)] 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Green-lighting recyclable device of LED-MGVC

Wang, Jung-Chang, Wen-Chou Chiang,, Huang, Chun-Ling, Huang-Lin Wu,

Year:

2012

Language:

english

File:

PDF, 905 KB

english, 2012

33

[IEEE 2017 International Conference on Applied System Innovation (ICASI) - Sapporo, Japan (2017.5.13-2017.5.17)] 2017 International Conference on Applied System Innovation (ICASI) - Intelligent algorithm design by using fuzzy inference on two-wheeled self-balancing vehicle

Wang, Jung-Chang, Huang, Chih-Peng, Hung, Jui-Chung

Year:

2017

Language:

english

File:

PDF, 633 KB

english, 2017

34

Thermoelectric transformation and illuminative performance analysis of a novel LED-MGVC device

Wang, Jung-Chang

Journal:

International Communications in Heat and Mass Transfer

Year:

2013

Language:

english

File:

PDF, 814 KB

english, 2013

35

Analysis of thermal conductivity in HI-LEDs lighting materials

Rong-Tsu Wang,Jung-Chang Wang

Journal:

Journal of Mechanical Science and Technology

Year:

2017

Language:

english

File:

PDF, 1.04 MB

english, 2017

36

[IEEE 2010 5th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2010.10.20-2010.10.22)] 2010 5th International Microsystems Packaging Assembly and Circuits Technology Conference - Vapor chamber in high power LEDs

Wang, Jung-Chang, Huang, Chun-Ling

Year:

2010

Language:

english

File:

PDF, 343 KB

english, 2010

37

3-D numerical and experimental models for flat and embedded heat pipes applied in high-end VGA card cooling system

Wang, Jung-Chang

Journal:

International Communications in Heat and Mass Transfer

Year:

2012

Language:

english

File:

PDF, 1.09 MB

english, 2012

38

[IEEE 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2011.10.19-2011.10.21)] 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Vapor chamber in high-end VGA card

Wang, Jung-Chang, Chen, Wei-Jui

Year:

2011

Language:

english

File:

PDF, 776 KB

english, 2011

39

CHARGE AND DISCHARGE CHARACTERISTICS OF A THERMAL ENERGY STORAGE DEVICE

Wang, Jung-Chang, Lin, Shu-Ju, Chen, Sih-Li, Lee, Wen-Shing

Journal:

Experimental Heat Transfer

Year:

2005

Language:

english

File:

PDF, 2.58 MB

english, 2005

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